Precision liquid cooling technology
Liquid Cooling Top Frame
Liquid Cooling Mid Frame
Liquid Cooling Bottom Frame
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Industry-leading IP

Built on two decades of applied research with hyperscalers, silicon providers and OEMs, our system architecture includes over 200 granted and pending patents that cover all aspects of data center liquid cooling.

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A unique approach to full system cooling

Unlike cold-plate technology that works best on flat surfaces, Iceotope's "direct-to-everything" method cools all components: processors, memory, storage, and PSUs.

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Lower energy costs, higher performance

Iceotope Precision Liquid Cooling maximizes energy efficiency and dramatically reduces water use, helping AI run sustainably for a cleaner, greener future.

benefits

Iceotope’s ”direct to everything” liquid cooling technology:

  • Removes the need for noisy fans
  • Improves reliability and processor uptime
  • Reduces energy consumption
  • Simplifies facility infrastructure
  • Enables unprecedented compute density
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40%
Less power usage
per kW of ITE power
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100%
Less water usage
per kW of ITE power
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40%
Lower carbon emissions
per kW of ITE power
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84%
Less cooling usage
per kW of ITE power
HOW IT WORKS

Precision liquid cooling technology is integrated at both the chassis and system level

Chassis Level Diagram
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At the chassis level

Each Iceotope server is precision-cooled within its own sealed chassis.

The sealed chassis contains a small quantity of single-phase dielectric coolant which is pumped through an in-chassis manifold in parallel to server hotspots, capturing heat through forced convection.

The dielectric coolant then cascades onto the motherboard capturing all the heat from all other components. The heat generated by each server is efficiently harvested and transferred to a Technology Cooling System (TCS) loop via a liquid-to-liquid heat exchanger positioned at the rear of each chassis. Iceotope's precision-cooled servers can be cooled using inlet water temperatures exceeding 55°C, depending on configuration.

System Level Diagram
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At the system level

Iceotope server chassis connect to standard data center TCS rack manifolds. The TCS circuit is managed by a Coolant Distribution Unit (CDU) that controls the flow rate, pressure, chemistry, and temperature of the TCS, ensuring seamless operation of the liquid cooling system.

Since dielectric fluid allows systems to operate at elevated temperatures, the rejected heat is typically warmer than the external environment allowing Iceotope systems to optionally use dry coolers that don’t require additional water for cooling. Instead, heat can be removed via ambient air or captured and reused for other purposes.