Custom Product
Co-Development
Iceotope develops precision liquid cooling solutions for OEMs or ODMs to manufacture, fulfill and sell at scale.
By directing dielectric fluid to the hottest components within a sealed chassis, our technology removes heat while retaining standard form factors compatible with existing infrastructure.
We supply the patented thermal architecture, reference designs, and engineering support required to integrate precision liquid cooling into enterprise compute and edge hardware.
Through IP licensing and joint engineering, we work alongside your team to help you bring differentiated, liquid-cooled products to market without a ground-up redesign.

Why Partner with Iceotope?
Our 219+ patents cover the entire cooling stack. You gain access to proven reference designs, full integration specifications, and detailed schematics for engineering development.
We develop and validate every technology in our own labs, then work with your engineering teams to develop production-ready products. You control SKU definition, deployment, and fulfillment.
Rack power is climbing fast: from 50-120 kW today to 1 MW+ by 2029. Liquid cooling is no longer an optional feature. Iceotope's IP puts your products ahead of the curve.
How it works
Proven IP and Technology
Thermal architecture, patents and design to take your product from concept to production-ready prototype
Hands-On Engineering Support
Co-development from day one, including lab access, integration support, and benchmarking against real-world workloads.
Licensing That Works for You
Flexible commercial terms (upfront IP license, per-unit royalty, or a combination of both) that are structured around your business model.
Example Co-Development Applications
Capturing complete thermal loads (including memory and VRMs) in AI/ML nodes where Direct-to-Chip (D2C) leaves residual heat requiring secondary air cooling

Delivering sealed, fanless chassis for manufacturing and industrial deployments exposed to particulates and humidity

Maintaining optimal thermal profiles across dense NVMe clusters to prevent thermal throttling and improve reliability

We are actively seeking co-development programs for applications where chassis-level precision liquid cooling can deliver a clear architectural advantage.
Interested in IP licensing or other development models?
Contact us to discuss next steps.