Iceotope Patent
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A sealed enclosure that contains hot components and an internal coolant that is pumped around a conduit carrying a separate external coolant, so heat is transferred between the two coolants without mixing.

Heat sink designs for electronic devices immersed in liquid coolant, where walls form a volume around the device or its top surface so coolant can absorb heat directly. Heat is transferred from the device into coolant held in this volume, optionally enhanced by a nozzle that directs coolant to the heat sink base.

Specialized heat sinks for electronic devices immersed in liquid coolant. These heat sinks use a base and surrounding walls to create a coolant-filled volume either around the device or above its heat-transmitting surface, including orientations where the device is mounted perpendicular to the container floor. Heat is transferred from the device into the coolant held in this volume, and a cooling module may incorporate nozzles that direct coolant onto the heat sink base for improved cooling performance.

Heat sink designs for electronic devices immersed in liquid coolant. The heat sinks use a base and surrounding walls to form a volume that holds coolant either around the device or above its heat‑transmitting surface, including when the device is mounted perpendicular to the container floor. Heat is transferred from the device into the coolant in this volume, and a cooling module may include nozzles that direct coolant onto the heat sink base to improve cooling.

Sealed cooling module for electronic devices that uses two (and optionally three) liquid coolants. A first liquid fills the module around the device, while a heat transfer device with a shaped conduction surface carries a second liquid through internal channels that conform closely to the component for efficient heat removal. The system also covers controlling the second liquid, exchanging heat between the second and a third liquid, and methods for filling the container with coolant.

Cooling system and method for multiple electronic devices within a single module. One liquid loop cools a first device and another liquid loop cools a second device, with both loops connected to a common heat exchanger so heat from the first coolant is transferred to the second coolant through the exchanger.

A cold plate that uses two isolated liquid coolants. A thermally conductive body mounts to an electronic device, transferring heat into an internal volume where a secondary coolant flows in and out through dedicated ports, while an external receptacle on the body holds a primary coolant so heat can be transferred between the two liquids without mixing.

A sealed module that houses electronic devices and a liquid coolant in a shared internal volume. Inside the housing, a substrate holds one device near the base, and a heat sink with a receptacle volume collects coolant around that device (or a thermally coupled component) so the coolant can absorb its heat more effectively.