Frequently Asked
Questions

Precision liquid cooling technology is integrated at both the chassis and system level.

Chassis level:

Iceotope’s precision cooling targets heat at its source, rather than the room or the rack. Iceotope precision liquid cooling does this with a small amount of dielectric coolant inside a fully sealed server chassis, pumped through an internal manifold that runs past the hottest components, where it absorbs heat through forced convection.

After targeting these hotspots, the coolant flows over the motherboard and other components, picking up remaining system heat. The total heat from each server is then transferred to a Technology Cooling System (TCS) loop via a liquid‑to‑liquid heat exchanger located at the rear of the chassis. Iceotope’s design supports inlet coolant temperatures above 55°C, enabling efficient warm‑water operation and easier heat reuse.

System level:

Liquid-cooled chassis connect to Technology Cooling System (TCS) rack manifolds commonly used in liquid‑cooled data centers. A Coolant Distribution Unit (CDU) manages the TCS loop, controlling coolant flow, pressure, water chemistry, and temperature to keep the liquid cooling system operating smoothly.

Precision liquid cooling uses dielectric fluid which allows servers to safely operate at higher temperatures. As a result, the rejected heat is typically warmer than the outside air, enabling the use of dry coolers that require no additional water. Excess heat can be removed via ambient air or captured for reuse in applications such as space heating or other onsite processes.

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Liquid cooling uses fluid rather than air to remove heat from server hardware. Because liquid transfers heat more efficiently than air, liquid cooling can support much higher rack densities than fan-based cooling, making it increasingly important for AI and high-performance computing workloads that generate more heat than traditional cooling can handle.

Precision liquid cooling is a hybrid of direct-to-chip (DTC) cooling and tank immersion cooling that delivers coolant directly to the hardware generating the most heat.

• Direct-to-chip liquid cooling efficiently cools CPUs and GPUs but leaves other components reliant on less effective air cooling, creating system inefficiencies.
• Immersion cooling offers comprehensive heat management but introduces challenges with maintenance, scalability, and potential contamination risks.
• Precision liquid cooling overcomes these limitations by targeting all critical components and eliminating the need for supplementary air cooling.

Precision liquid cooling can reduce energy use and carbon emissions by up to 40%, cooling costs by 83% and water consumption by up to 96% by operating at high coolant temperatures and using dry coolers and/or chillers instead of evaporative systems. The technology enables maximum energy efficiency in both datacenter and edge deployment scenarios; it also allows heat recapture for secondary uses like building heating and supports sustainability initiatives while maintaining or improving performance.

Iceotope's patented technology uses dielectric coolant to create a protective environment that improves hardware resilience by supporting 1500W+ rack power densities and reducing system contaminants. Since fans are not used to cool hardware components, precision liquid-cooled systems operate in near silence and in almost any environment. Precision liquid cooling technology:

• Removes the need for noisy fans
• Improves reliability and processor uptime
• Reduces energy consumption
• Simplifies facility infrastructure
• Enables unprecedented compute density

Unlike cold-plate technology that works best on flat surfaces, Iceotope's "direct-to-everything" method cools all components: processors, memory, storage, and PSUs. Precision liquid cooling maximizes energy efficiency and dramatically reduces water use, helping AI run sustainably for a cleaner, greener future. Built on years of validation with OEMs, fluid providers, and hyperscalers, Iceotope's system architecture includes 228 pending, issued, and allowed patents that cover all aspects of data center liquid cooling.

Precision liquid cooling uses single phase dielectric liquid coolants; there is no boiling, condensation, or vapor. Systems require 5–10x less fluid than typical single‑phase immersion tanks, while cooling more effectively. Fluids go through an approval program, are people- and planet-safe, and have high boiling points so they do not measurably evaporate even if a chassis is open.

Precision liquid cooled systems typically operate with a 50-55℃ dielectric fluid temperature. This relatively high temperature may seem counterintuitive, but the dielectric fluid is around 2000x more effective than air at removing heat from components. The advanced heat removal properties of the fluid allow electronic components to operate well within specifications, even at elevated coolant temperatures. The higher the coolant temperature, the easier and more energy efficient it is to reuse or reject heat to another source such as a heating system or outside air. The dielectric temperature point represents a balance between enhanced system efficiency, resilience and user safety.

Most components can be serviced like a normal air-cooled server without draining the fluid. Each chassis includes sensors for fluid temperature, fill level, and pump speed and management ports for integration with facility monitoring systems. AC–DC power supplies are also precision-cooled.

Each chassis or system has its own isolated coolant volume and can be filled or drained independently without impacting neighboring chassis.

Precision liquid-cooled chassis fit into vertical, data center‑compliant racks and can be co‑mounted alongside air-cooled equipment or cold plate racks. Air cooled equipment can also be installed above, below or between precision liquid cooled hardware. While traditional air-cooled IT is fundamentally limited in power density by component layout, airflow, and facility cooling capacity, precision liquid cooling removes these air handling bottlenecks and enables much higher server and rack power densities.

The technology is also well-suited for edge applications and harsh environments. Precision liquid-cooled solutions can be deployed in non-traditional configurations because the systems are silent, sealed and fan-less. Hardware is available in near-edge thermal routing cabinet configurations that are ideal for space-constrained locations.