Frequently Asked
Questions

Precision liquid cooling combines the best attributes of tank immersion and direct‑to‑chip cooling. Similar to tank immersion systems, it captures almost 100% of the heat generated by high power electronics, which can be reused or efficiently rejected to the environment using minimal energy.

This cooling technology also precisely targets hotspots for high performance component cooling like direct-to‑chip systems. It removes almost all the heat from electronic components by delivering a small volume of dielectric fluid directly to any heat-generating hardware, preventing hotspots and supporting demanding AI and high‑performance workloads.

Precision liquid cooling can reduce energy use and carbon emissions by up to 40%, cooling costs by 83% and water consumption by up to 96% by operating at high coolant temperatures and using dry coolers and/or chillers instead of evaporative systems. The technology enables maximum energy efficiency in both datacenter and edge deployment scenarios; it also allows heat recapture for secondary uses like building heating and supports sustainability initiatives while maintaining or improving performance.

Iceotope's patented technology uses dielectric coolant to create a protective environment that improves hardware resilience by supporting 1500W+ rack power densities and reducing system contaminants. Since fans are not used to cool hardware components, precision liquid-cooled systems operate in near silence and in almost any environment.

Precision liquid cooling uses single phase dielectric liquid coolants; there is no boiling, condensation, or vapor. Systems require 5–10x less fluid than typical single‑phase immersion tanks, while cooling more effectively. Fluids go through an approval program, are people- and planet-safe, and have high boiling points so they do not measurably evaporate even if a chassis is open.

Precision liquid cooled systems typically operate with a 50-55℃ dielectric fluid temperature. This relatively high temperature may seem counterintuitive, but the dielectric fluid is around 2000x more effective than air at removing heat from components. The advanced heat removal properties of the fluid allow electronic components to operate well within specifications, even at elevated coolant temperatures. The higher the coolant temperature, the easier and more energy efficient it is to reuse or reject heat to another source such as a heating system or outside air. The dielectric temperature point represents a balance between enhanced system efficiency, resilience and user safety.

Most components can be serviced like a normal air-cooled server without draining the fluid. Each chassis includes sensors for fluid temperature, fill level, and pump speed and management ports for integration with facility monitoring systems. AC–DC power supplies are also precision-cooled.

Each chassis or system has its own isolated coolant volume and can be filled or drained independently without impacting neighboring chassis.

Precision liquid-cooled chassis fit into vertical, data center‑compliant racks and can be co‑mounted alongside air-cooled equipment or cold plate racks. Air cooled equipment can also be installed above, below or between precision liquid cooled hardware. While traditional air-cooled IT is fundamentally limited in power density by component layout, airflow, and facility cooling capacity, precision liquid cooling removes these air handling bottlenecks and enables much higher server and rack power densities.

The technology is also well-suited for edge applications and harsh environments. Precision liquid-cooled solutions can be deployed in non-traditional configurations because the systems are silent, sealed and fan-less. Hardware is available in near-edge thermal routing cabinet configurations that are ideal for space-constrained locations.