Powering mission-critical compute for the tactical edge
Defense and security workloads like autonomous systems, ISR and real-time AI inference at the tactical edge demand compute that works reliably in conditions that would disable conventional infrastructure. Iceotope precision liquid cooling technology enables high-density, ruggedized compute in sealed, fanless chassis that withstand dust, vibration, humidity, and extreme temperatures.
Liquid cooled systems eliminate acoustic signature, reduce thermal overload risk, and deliver data centre-grade processing density in vehicle-mounted, shipborne, airborne, and forward-operating environments where failure is not an option.
Resilient, silent, and deployable for whatever the mission demands
Iceotope precision liquid cooling technology in a sealed, fanless chassis captures almost 100% of system heat, with no moving parts and no dependence on conditioned air. The result is compute infrastructure that is as reliable in a forward operating base as it is in a protected data facility.
Acoustic stealth for sensitive operations
With no fans and sub-50dB operation, Iceotope-cooled systems produce no acoustic signature, ideal for deployments where noise discipline is a operational requirement.
Ruggedised for harsh and contested environments
Sealed chassis protects against dust, sand, and humidity. Precision liquid cooling maintains stable thermal performance across extreme temperature ranges.
High-density AI compute in constrained form factors
Vehicle-mounted platforms have no space for conventional air-cooled rack infrastructure. Precision liquid cooling removes the need for facility water or CRAC units.
Precision liquid cooling solutions ready for the next generation of AI.
Liquid-cooled, self-contained thermal routing cabinet solutions that integrate compute, cooling, networking, memory, and storage and can be deployed in almost any environment, without requiring access to facility water or dry chillers.
Fully-sealed server rack chassis solutions with environmentally safe dielectric coolant that efficiently captures almost all heat generated by high-performance CPUs, GPUs, and other components in datacenter environments.
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