AI is heating up.We keep it cool.
The future of AI demands a thermal architecture that eliminates heat without sacrificing performance. Iceotope co-designs and licenses precision liquid cooling technology to OEMs and ODMs building the next generation of AI.
Our patented, chassis-level immersion cooling keeps GPUs, CPUs, storage, memory, and power supplies operating at peak performance while significantly reducing energy use and failure points.
The future of AI and HPC runs hot.
Iceotope precision liquid cooling keeps systems operating at peak performance.
Iceotope holds 228 pending, issued, and allowed patents that cover all aspects of chassis-level precision liquid cooling. We co-design thermal solutions for OEMs and ODMs and license our cooling technology.
Unlike cold-plate technology that works best on flat surfaces, Iceotope's "direct to everything" method cools all components: processors, memory, storage, and PSUs.
Iceotope precision liquid cooling maximizes energy efficiency and dramatically reduces water use, helping AI run sustainably for a cleaner, greener future.
More reliable. More flexible. More sustainable.
- Removes the need for noisy fans
- Improves reliability and processor uptime
- Reduces energy consumption
- Simplifies facility infrastructure
- Enables unprecedented compute density
Iceotope co-designs and licenses IP to OEMs and ODMs building the next generation of AI hardware. Our precision liquid cooling technology uses environmentally-friendly dielectric fluid to eliminate heat, contaminants and vibration from all system components.
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Iceotope precision liquid cooling technology is integrated at both the chassis and system level
At the chassis level
Iceotope precision liquid cooling uses a small amount of dielectric coolant inside a fully sealed server chassis. The coolant is pumped through an internal manifold that runs past the hottest components, where it absorbs heat through forced convection
After targeting these hotspots, the coolant flows over the motherboard and other components, picking up remaining system heat. The total heat from each server is then transferred to a Technology Cooling System (TCS) loop via a liquid‑to‑liquid heat exchanger located at the rear of the chassis. Iceotope’s design supports inlet coolant temperatures above 55°C, enabling efficient warm‑water operation and easier heat reuse.
At the system level
Liquid-cooled chassis connect to Technology Cooling System (TCS) rack manifolds commonly used in liquid‑cooled data centers. A Coolant Distribution Unit (CDU) manages the TCS loop, controlling coolant flow, pressure, water chemistry, and temperature to keep the liquid cooling system operating smoothly
Precision liquid cooling uses dielectric fluid which allows servers to safely operate at higher temperatures. As a result, the rejected heat is typically warmer than the outside air, enabling the use of dry coolers that require no additional water. Excess heat can be removed via ambient air or captured for reuse in applications such as space heating or other onsite processes.
Iceotope precision liquid cooling supports high density, low latency AI, HPC and edge workloads in almost any environment.
Precision liquid cooling for OEMs/ODMs building the next generation of AI.
Liquid-cooled, self-contained thermal routing cabinet designs that integrate compute, cooling, networking, memory, and storage and can be deployed in almost any environment, without access to facility water or dry chillers.
Fully-sealed server rack chassis designs that use dielectric fluid to efficiently capture almost all heat generated by high-performance CPUs, GPUs, and other components in datacenter environments.
Work with our team to bring precision liquid cooled technology to market without ground-up redesign.
Our 228 pending, issued, and allowed patents cover the entire cooling stack. You gain access to proven reference designs, full integration specifications, and detailed schematics for engineering development.
We develop and validate in our own labs, then work with your engineering teams to develop production-ready products. You control SKU definition, deployment, and fulfillment.
Rack power is climbing fast: from 50-120 kW today to 1 MW+ by 2029. Liquid cooling is no longer an optional feature. Iceotope's IP puts your products ahead of the curve.
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