The future of AI and HPC runs hot.
Iceotope liquid cooling keeps AI systems operating at peak performance.
Our patented system architecture includes over 175 granted and pending patents that cover all aspects of chassis-level precision liquid cooling.
Unlike cold-plate technology that works best on flat surfaces, Iceotope's "direct to everything" method cools all components: processors, memory, storage, and PSUs.
Iceotope precision liquid cooling maximizes energy efficiency and dramatically reduces water use, helping AI run sustainably for a cleaner, greener future.
More reliable. More flexible. More sustainable.
- Removes the need for noisy fans
- Improves reliability and processor uptime
- Reduces energy consumption
- Simplifies facility infrastructure
- Enables unprecedented compute density
Iceotope’s precision liquid cooling eliminates heat, contaminants and vibration that cause component failure. In the data center or at the edge, we enable AI and HPC hardware to work in any environment. Our technology uses environmentally-friendly dielectric fluid to efficiently harvest heat from all system components and safely reject it via a dry cooler.
.svg){kind=small}
Iceotope precision liquid cooling technology is integrated at both the chassis and system level
At the chassis level
Iceotope precision liquid cooling uses a small amount of dielectric coolant inside a fully sealed server chassis. The coolant is pumped through an internal manifold that runs past the hottest components, where it absorbs heat through forced convection
After targeting these hotspots, the coolant flows over the motherboard and other components, picking up remaining system heat. The total heat from each server is then transferred to a Technology Cooling System (TCS) loop via a liquid‑to‑liquid heat exchanger located at the rear of the chassis. Iceotope’s design supports inlet coolant temperatures above 55°C, enabling efficient warm‑water operation and easier heat reuse.
At the system level
Liquid-cooled chassis connect to Technology Cooling System (TCS) rack manifolds commonly used in liquid‑cooled data centers. A Coolant Distribution Unit (CDU) manages the TCS loop, controlling coolant flow, pressure, water chemistry, and temperature to keep the liquid cooling system operating smoothly
Precision liquid cooling uses dielectric fluid which allows servers to safely operate at higher temperatures. As a result, the rejected heat is typically warmer than the outside air, enabling the use of dry coolers that require no additional water. Excess heat can be removed via ambient air or captured for reuse in applications such as space heating or other onsite processes.
Iceotope precision liquid cooling supports high density, low latency AI, HPC and edge workloads in almost any environment.
Precision liquid cooling solutions ready for the next generation of AI and HPC.
Liquid-cooled, self-contained thermal routing cabinet solutions that integrate compute, cooling, networking, memory, and storage and can be deployed in almost any environment, without requiring access to facility water or dry chillers.
Fully-sealed server rack chassis solutions with environmentally safe dielectric coolant that efficiently captures almost all heat generated by high-performance CPUs, GPUs, and other components in datacenter environments.
Work with our team to bring precision liquid cooled products to market without ground-up redesign.
Our 219+ patents cover the entire cooling stack. You gain access to proven reference designs, full integration specifications, and detailed schematics for engineering development.
We develop and validate every technology in our own labs, then work with your engineering teams to develop production-ready products. You control SKU definition, deployment, and fulfillment.
Rack power is climbing fast: from 50-120 kW today to 1 MW+ by 2029. Liquid cooling is no longer an optional feature. Iceotope's IP puts your products ahead of the curve.
Ready to talk?
