AI is heating up.
We keep it cool.

Your AI hardware. Our cooling technology.

The future of AI demands a thermal architecture that eliminates heat without sacrificing performance. Iceotope co-designs and licenses precision liquid cooling technology to OEMs and ODMs building the next generation of AI.

trusted by indsutry leaders
thermal architecture designed for next-gen hardware

The future of AI and HPC runs hot.
Iceotope precision liquid cooling keeps systems operating at peak performance.

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Industry-leading IP

Our 228 pending, issued, and allowed patents support chassis-level precision liquid cooling. We co-design thermal solutions for OEMs and ODMs and license our technology.

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A unique approach to full system cooling

Unlike cold-plate technology that works best on flat surfaces, Iceotope's "direct to everything" method cools all components: processors, memory, storage, and PSUs.

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Lower energy costs, higher performance

Iceotope precision liquid cooling maximizes energy efficiency and dramatically reduces water use, helping AI run sustainably for a cleaner, greener future.

Less water usage
per kW of ITE power
Less power usage
per kW of ITE power
Less cooling usage
per kW of ITE power
Lower carbon emissions
per kW of ITE power
technology

Iceotope precision liquid cooling is integrated at both the chassis and system level.

Our patented, chassis-level immersion cooling keeps GPUs, CPUs, storage, memory, and power supplies operating at peak performance while significantly reducing energy use and failure points

OEM/ODM Reference Designs

Discover precision liquid cooling reference designs for the next generation of AI.

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Black Iceotope server rack with multiple modules and the Iceotope logo on top and on each module.
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Edge
Reference Design

A liquid-cooled AI inferencing cluster that integrates compute, cooling, networking, memory and storage into a compact solution that can be deployed in almost any environment, without requiring facility water or dry chillers.

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Open rack server with internal components including three large circuit boards connected by blue cables, with multiple ports on the front panel labeled iceotope.
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Datacenter
Reference Design

Liquid-cooled data center solutions designed to handle the increasing demands of high-density, low-latency workloads. Compatible with existing rack deployments, KUL AI ensures stable thermal management, even under peak load conditions.

co-development and IP Licensing

Work with our team to integrated next-gen thermal architecture without ground-up redesign.

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AI-Optimized Performance

Our 228 pending, issued, and allowed patents cover the entire cooling stack. You gain access to proven reference designs, full integration specifications, and detailed schematics for engineering development.

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Proven and Tested

We develop and validate in our own labs, then work with your engineering teams to develop production-ready products. You control SKU definition, deployment, and fulfillment.

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Market Urgency

Rack power is climbing fast: from 50-120 kW today to 1 MW+ by 2029. Liquid cooling is no longer an optional feature. Iceotope's IP puts your products ahead of the curve.

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Find out how Iceotope can help you build AI infrastructure that's more resilient, efficient, and cost-effective.