Welcome to our FAQs, your go-to resource for answers to the most commonly asked questions about our products and technology. Explore the questions below to find the information you need, and if you don't see your question listed, feel free to reach out to our support team for personalized assistance.

Our studies have shown the CAPEX to be parity or cost down to air cooled and other liquid cooled solutions in the industry. When considering OPEX, white paper analysis shows the cost to be equivalent to air cooled solutions at a typical rack power of 10kW, while offering a savings at power levels greater than 10kW. 

We are fluid agnostic and can use several different fluid types. That said, we do require use of engineered dielectric fluids that have good performance characteristics which meet the basic materials compatibility requirements of our solution. 

No, not usually. Most components can be serviced just like a normal air-cooled server without drain, as our solution is partial immersion, and allows for touch point access without putting your hands in the fluid bath. We do recommend you drain the fluid for CPU replacement however, to prevent fluid contamination from the grease thermal interface. 

The volume of coolant in the chassis is dependent on the IT configuration of the device. The Iceotope system uses as little fluid as possible by carefully distributing within the chassis, proportionate to the cooling duty of individual components. 

No, we do not need to use phase change. Our dielectric fluid does not boil, as its boiling point is above the temperatures generated by the electronics. 

No, Iceotope's Precision Liquid Cooling technologies are completely fanless. 

Temp of secondary circuit into the heat exchanger = up to 45°C (conforms to ASHRAE W4); Dielectric fluid = up to 70°C; Max operating temp of the processors = typically up to 85°C (dependent on processor and vendor guidelines).

We read IPMI data from the motherboard and from temperature sensors on the heat exchanger. 

Yes, the power supply is liquid-cooled within the chassis. 

No, we use specially engineered dielectric coolants to collect the heat from the hot electronics. 

Yes, in a good way. The coolant creates a protective environment for the servers, allowing them to perform better and last longer. 

As the coolant creates a protective environment, the requirement for servicing is greatly reduced but should you be required to upgrade a component the process is very similar to that in an air-cooled chassis. Many components can be serviced like air-cooled servers, but system planar board replacement may require fluid to be drained.  

Yes, the coolant can be removed from the chassis while it is still supported in the cabinet if required. 

Deionised water can be up to 45°C into the rack. This means that the TCS coolant does not need to be chilled. 


Maintaining a maximum of 7°C delta T allows for useful heat reject temperatures while minimizing the flow requirements of the water cooling loop. 

The circuit uses de-ionised water with biocides and corrosion inhibitors. 

Other than when using a dry cooler, a CDU is required to control tempterature, pressure, flow rate and quality of the de ionised water circuit and thus protect your equipment. 

600mm wide x 1520mm deep x 2270mm tall (48U). 

600mm/ 750mm wide x 1460mm deep x 1215mm tall (24U). 

KUL 2 does not use fans for cooling, and the data hall does not need the air-handling equipment and hot-aisle/cold-aisle containment. Servers can be loaded more densely into each rack. 

Manifolds are connected to the water coolant circuit  using flexible hoses which are supplied with Eaton FD83 Series full flow dual interlock couplings. 

We currently design for air cooling, working to deliver air temp of 18 - 27°C into the chassis. How does this compare with 45°C water into the chassis?

ASHRAE (American Society of Heating, Refrigeration and Air-Conditioning Engineers) have published guidelines for both air-cooling and liquid-cooling of IT equipment in Data Centres. Setting a maximum allowable air input to the chassis is to ensure that the processors run as efficiently as possible and do not overheat. As air cooling is a lot less efficient than liquid cooling, the air-input temperatures need to be considerably lower than liquid-input temperatures for liquid cooling. We can achieve the same or better levels of cooling using  45°C liquid than with 27°C air. 

Due to the high output temperature of KUL 2, the heat generated can be rejected via In-Rack HRU, External Dry Cooler, traditional CDU or In-Row HRU. 

No, the water-based building-level cooling circuit only flows through the plate heat exchanger to pick up the heat from the dielectric coolant. 

Yes, the cooling system is flexible to accommodate different IT configurations. Our IO PCBs allow the chassis to be configured to provide IO ports that are appropriate to the IT. 

Yes, KUL 2 is configured to have two power feeds as standard. 

Each KUL 2 can cool up to 3.5kW of IT, depending on flow rate and input temperature of the secondary-cooling circuit