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Neil Edmunds is the Chief Innovation Officer at Iceotope Technologies, a global leader in precision liquid cooling for data centers and edge infrastructure.

Promoted to this role in March 2026, he has over a decade of experience as a technologist, product leader, and inventor specializing in dielectric cooling systems.

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Neil Edmunds

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Benefits of liquid cooling for AI workloads
Blog Posts
Blog Posts
September 17, 2024
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Neil Edmunds

Benefits of liquid cooling for AI workloads

As AI power use surges, liquid cooling cuts data center energy by 40%, shrinks footprint, recovers heat, and keeps next‑gen GPU racks running efficiently.

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Unlocking data center potential with liquid cooling
Blog Posts
Blog Posts
August 9, 2024
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Neil Edmunds

Unlocking data center potential with liquid cooling

Direct‑to‑everything liquid cooling captures nearly all server heat in a rack‑based, system, boosting efficiency, density, and sustainability.

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Iceotope sets new 1500W chip cooling standard
Blog Posts
Blog Posts
April 24, 2024
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Neil Edmunds

Iceotope sets new 1500W chip cooling standard

A new liquid cooling milestone keeps 1500W chips within safe limits, providing future‑ready thermal performance for ultra‑dense AI and HPC workloads.

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Chip cooling at 1000W and beyond
Whitepapers
Whitepapers
March 1, 2023
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Neil Edmunds

Chip cooling at 1000W and beyond

Achieving new levels of data center cooling with single phase precision liquid cooling.

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Single-phase immersion cooling of high density storage
Whitepapers
Whitepapers
October 24, 2022
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Neil Edmunds

Single-phase immersion cooling of high density storage

In this paper, a standard air-cooled high-density storage system is reengineered to demonstrate the use of single-phase immersion cooling.

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Cundall Engineering report: comparison of liquid and air cooling for data centers
Whitepapers
Whitepapers
March 6, 2021
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Neil Edmunds

Cundall Engineering report: comparison of liquid and air cooling for data centers

Iceotope’s precision liquid cooling enables higher rack densities, smaller data hall footprints, and simpler heat rejection equipment than air‑cooled designs.

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