ENEOS + Iceotope: Powering sustainable AI cooling
Key takeaways
● ENEOS and Iceotope are working together on liquid cooling for AI hardware, combining ENEOS’s immersion cooling fluids with Iceotope’s precision liquid cooling hardware.
● The partnership is positioned around sustainability and performance, aiming to reduce energy use, water consumption, and cooling constraints as AI workloads drive higher rack densities.
● ENEOS’s presence at OCP EMEA 2026 will highlight this collaboration as a practical approach for building open, efficient, and lower-carbon data center infrastructure.
As the Open Compute Project (OCP) EMEA Summit returns to Barcelona, data center operators and AI leaders are converging around one core challenge: how to cool increasingly power-hungry infrastructure sustainably and efficiently. ENEOS and Iceotope are aligned on this mission, combining advanced immersion cooling fluids with precision liquid cooling architectures to enable the next generation of AI and high-performance computing at scale.
At OCP EMEA, ENEOS is showcasing how its key immersion cooling fluids (ENEOS IXSeries) integrate with an ecosystem of innovators, including Iceotope, to help operators design AI-ready, energy-efficient, and lower-carbon data centers.
Why cooling innovation matters now
AI workloads, especially GPU-dense systems for training and inference, are driving unprecedented rack power densities and heat loads. Traditional air cooling is increasingly unable to keep up without significant over-provisioning of power and space, pushing operators toward more efficient liquid cooling strategies.
Immersion and precision liquid cooling directly remove heat at the component level using non-conductive dielectric fluids, delivering far higher thermal efficiency than air and reducing reliance on energy-intensive chillers and fans. By improving thermal management, these approaches can unlock higher compute density, extend hardware life, and support more predictable performance for AI and HPC workloads.
ENEOS IX Series for the AI era
ENEOS IX Series is a family of single-phase immersion cooling fluids engineered specifically for server and data center environments. The fluids are non-conductive, allowing servers to be fully submerged so heat can be removed directly from components rather than relying on air flow across heat sinks.
A critical feature of this series is the high flash points each type of fluid delivers. The IX Series has been formulated to balance high cooling performance with safety and long-term stability. The series includes:
● Type J (high flash point): Achieves a flash point over 250°C, classifying it as a non-dangerous good under Japanese fire safety regulations, offering low viscosity and high cooling efficiency
● Type B (bio-based): This fluid uses plant-derived raw materials to significantly reduce CO2 emissions throughout the product lifecycle and contribute to carbon neutrality.
● Type H (high cooling efficiency): Focuses on low viscosity with an auto-ignition point exceeding 300°C as specified by the OCP standards.
Iceotope’s precision liquid cooling leadership
Iceotope is a pioneer of precision liquid cooling solutions that combine the benefits of direct-to-chip and immersion cooling in a sealed, rack-based form factor. Each server or component is enclosed in its own chassis, with a small volume of dielectric fluid circulating to capture heat from processors, memory, storage, and power components before transferring it to a secondary water loop.
This “direct-to-everything” approach allows for high thermal capture while leveraging standard racks and familiar data center infrastructure, simplifying deployment and operations. Iceotope has also reported significant gains in energy efficiency and water reduction versus traditional air cooling, while enabling higher rack density and near-silent operation.
Its technology leadership is reinforced by a broad patent portfolio across chassis design, dielectric fluid use, and rack-scale thermal management. The company has validated its solutions across AI, storage, and edge workloads where thermal efficiency and reliability are critical.
ENEOS IX approved for Iceotope solutions
The collaboration between ENEOS and Iceotope reached an important milestone when Iceotope added the ENEOS IX Series immersion cooling fluids to its approved fluid vendors list. That approval means ENEOS IX fluids are qualified for use within Iceotope’s environmentally focused precision liquid cooling platforms, creating an end-to-end solution that pairs optimized coolant chemistry with advanced cooling hardware.
By aligning ENEOS IX with Iceotope’s sealed chassis architecture and “direct-to-everything” cooling design, the partnership gives data center operators an integrated path to liquid-cooled AI and HPC infrastructure. The combination is designed to support high compute density while targeting reductions in energy use and water consumption.
Advancing sustainable AI infrastructure
Both ENEOS and Iceotope see sustainable AI infrastructure as a multi-dimensional challenge that spans energy efficiency, thermal performance, materials, and lifecycle environmental impact. ENEOS is also investing in AI-driven R&D to accelerate the discovery of next-generation immersion cooling fluids and lubricants.
At the same time, Iceotope continues refining its precision liquid cooling architectures to support higher power densities, emerging chip designs, and edge deployments. Together, these efforts are aimed at giving operators practical solutions that are technically advanced and aligned with carbon-reduction and water-saving goals.
What to expect at OCP EMEA 2026
The OCP EMEA Summit in Barcelona is a key forum for discussions around open, efficient, and sustainable data center design, with AI and liquid cooling central to the 2026 agenda. ENEOS will be present to highlight how ENEOS IX Series integrate into open architectures and partner ecosystems, including precision liquid cooling solutions from Iceotope.
Attendees can expect conversations about how immersion and precision liquid cooling can be adopted within OCP-aligned hardware platforms to support AI, cloud, and edge workloads at scale. For operators, the ENEOS–Iceotope pairing offers a practical blueprint for building data centers that are ready for the next wave of AI while reducing environmental impact.
Looking ahead
The ENEOS–Iceotope partnership reflects a broader shift in how the industry approaches cooling: from treating it as a constraint to using it as a strategicenabler of AI growth and sustainability. As AI systems grow more powerful and thermally demanding, integrated solutions that combine advanced fluids andprecision hardware will become increasingly important.
In the years ahead, continued innovation in immersion cooling chemistry, precision liquid cooling architectures, and AI-assisted materials discovery is likely to unlock even more efficient and flexible designs for AI and HPC infrastructure. ENEOS and Iceotope are positioned to play a leading role in helping operators transition to high-density, low-impact data centers.
