Ku:l chassis-level precision immersion

Our studies have shown the CAPEX to be parity or cost down to air cooled and other liquid cooled solutions in the industry. When considering OPEX, white paper analysis shows the cost to be equivalent to air cooled solutions at a typical rack power of 10kW, while offering a savings at power levels greater than 10kW.

We are fluid agnostic and can use several different fluid types. That said, we do require use of engineered dielectric fluids that have good performance characteristics which meet the basic materials compatibility requirements of our solution.

No, not usually. Most components can be serviced just like a normal air-cooled server without drain, as our solution is partial immersion, and allows for touch point access without putting your hands in the fluid bath. We do recommend you drain the fluid for CPU replacement however, to prevent fluid contamination from the grease thermal interface.

The volume of coolant in the chassis is dependent on the IT configuration of the device. The Iceotope system uses as little fluid as possible by carefully distributing within the chassis, proportionate to the cooling duty of individual components.

No, we do not need to use phase change. Our dielectric fluid does not boil, as its boiling point is above the temperatures generated by the electronics.

No, Iceotope's chassis-level technologies are completely fanless.

Temp of secondary circuit into the heat exchanger = up to 45oC (conforms to ASHRAE W4)

Dielectric fluid = up to 70oC

Max operating temp of the processors = typically up to 85oC (dependent on processor and vendor guidelines)

We read IPMI data from the motherboard and from temperature sensors on the heat exchanger.

Yes, the power supply is liquid-cooled within the chassis.