Date published

24 Apr 2024


Dr Kelley Mullick & Dr Jasper Kidger

The data center industry is grappling with escalating thermal demands driven by the compute densities required for AI workloads and the rising thermal design power of IT equipment. The search for sustainable cooling solutions has intensified. 

Recently, Iceotope undertook a groundbreaking test in our state-of-the-art testing facility to demonstrate our ability to cool next-generation chips, with remarkable success. We announced earlier this year the ability to achieve chip-level cooling at 1000W with single phase Precision Liquid Cooling. We were also able to demonstrate enhanced thermal performance capability compared to other competing liquid cooling technologies.

Today we are pleased to announce that we have achieved another chip-level cooling milestone at 1500W.

Following the same testing procedure outlined in our 1000W testing, we raised the chip power to 1500W, with a dielectric supply temperature at an easily attainable 28.6° Celsius. Our system was able to keep the CPU to an 85°C case temperature, which is typically within acceptable tolerances for silicon chip devices. The overall thermal resistance from dielectric inlet to CPU Tcase was a remarkable 0.037 K/W.

A key success factor of this testing lies in our utilization of forced convection for heat transfer, a stark departure from the natural convection approach commonly associated with traditional tank immersion cooling methods. We observed that our thermal resistance remained consistently low across varying chip power levels, from the 350W of today's devices to the 1500W of tomorrow's, affirming the scalability and reliability of our solutions, demonstrated in the table below. By harnessing forced convection, we significantly enhance heat transfer efficiency, enabling us to effectively cool high-power chips with unparalleled precision and reliability. 

With this testing, we have been able to demonstrate that Precision Liquid Cooling technology will meet the thermal demands of future computing architectures. By demonstrating we can effectively cool future generation devices with power ratings up to 1500W, Iceotope has demonstrated that our Precision Liquid Cooling offers a sustainable and future-proof high-performance liquid cooling solution. Notably, our solutions offer thermal resistances comparable to water-cooled direct-to-chip cold plate offerings, demonstrating superior systems-level cooling efficiency crucial for AI workloads and other compute-intensive applications. 

In summary, this achievement represents a significant advancement in liquid cooling technology. By pushing the boundaries of what is possible in cooling high-power chips, we reaffirm our commitment to innovation and excellence, propelling the industry towards a sustainable and high-performance future in data center cooling.