Precision Liquid Cooling
Built on two decades of applied research with hyperscalers, silicon providers and OEMs, our system architecture includes over 200 granted and pending patents that cover all aspects of data center liquid cooling.
Unlike cold-plate technology that works best on flat surfaces, Iceotope's "direct-to-everything" method cools all components: processors, memory, storage, and PSUs.
Precision liquid cooling maximizes energy efficiency and dramatically reduces water use, helping AI run sustainably for a cleaner, greener future.
Iceotope’s ”direct to everything” liquid cooling technology:
- Removes the need for noisy fans
- Improves reliability and processor uptime
- Reduces energy consumption
- Simplifies facility infrastructure
- Enables unprecedented compute density
Precision liquid cooling technology is integrated at both the chassis and system level
At the chassis level
Iceotope precision liquid cooling uses a small amount of dielectric coolant inside a fully sealed server chassis. The coolant is pumped through an internal manifold that runs past the hottest components, where it absorbs heat through forced convection
After targeting these hotspots, the coolant flows over the motherboard and other components, picking up remaining system heat. The total heat from each server is then transferred to a Technology Cooling System (TCS) loop via a liquid‑to‑liquid heat exchanger located at the rear of the chassis. Iceotope’s design supports inlet coolant temperatures above 55°C, enabling efficient warm‑water operation and easier heat reuse.
At the system level
Liquid-cooled chassis connect to Technology Cooling System (TCS) rack manifolds commonly used in liquid‑cooled data centers. A Coolant Distribution Unit (CDU) manages the TCS loop, controlling coolant flow, pressure, water chemistry, and temperature to keep the liquid cooling system operating smoothly
Precision liquid cooling uses dielectric fluid which allows servers to safely operate at higher temperatures. As a result, the rejected heat is typically warmer than the outside air, enabling the use of dry coolers that require no additional water. Excess heat can be removed via ambient air or captured for reuse in applications such as space heating or other onsite processes.
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